High tensile strength, high tear strength, high elongation
Room temperature cure
No-sag
Designed for yoke and printed wire board or PCB assembly by pilots as an aviation sealant for aircraft repairs on various airplane area's, including openings and cracks in metal casings
Adheres well to glass, metals, ceramics, silicone rubber, and many plastics
Heightened thermal stability, remains stable from -50°C to +200°C, and has excellent dielectric properties
Adhesive is non-flow and offers primer-less adhesion, vibration resistance, moisture protection, and helps materials resist thermal and mechanical shock
Meets Mil Spec requirements and works well sealing housings, modules and electrical leads
